Universal Finish: Eliminating nickel from circuits improves signal integrity and allows for tighter spacing between circuits. Electroless Palladium and Mixed Reaction Immersion Gold (or Semi Autocatalytic Gold) provides this solution. 4-6u” of Pd and 4-6u” of Au has proven to be excellent for gold wire bonding and soldering. Note 4-6u” Pd is also a very good diffusion barrier. Customer responses have been assemblers love it!
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